Silicon on Insulator CMOS Technology

Brand：Gas Turbine Model：Silicon on Insulator CMOS Technology

Key to the silicon on insulator (SOI) complementary metal oxide semiconductor (CMOS) is the insulating layer of silicon dioxide (SiO2) isolating the integrated circuit transistors from the bulk substrate. This feature has a number of benefits:
Low leakage current to substrate enables greatly improved circuit operation to 225°C continuous and excursions to 300°C
Reduced capacitance for faster and lower power circuits
Greatly reduced noise with isolation from the bulk silicon for sensitive mixed signal circuits
At extreme temperatures, the packaging and assembly are critical to the reliability of the product. We employ methods and materials to ensure quality and reliability for harsh environments. We provide a wide variety of packages for your application specific integrated circuits(ASIC), many of which are qualified to MIL-PRF-38535 and screened to MIL-STD-883 for extreme environments.
The robust packaging materials and methods also apply to multi-chip modules (MCM). We have implemented designs with over 20 chips in one package.
High levels of integration can be achieved through the HT2000 gate array technology. This can incorporate up to 290k gates of usable gates. The technology also supports analog and mixed signal designs.
Using a formal phase-gate process, we assure the reliability of the SOI CMOS and products. This approach includes adhering to our general manufacturing standards for:
Designing in reliability by establishing electrical rules based on wear out mechanism characterization performed on specially designed test structures (electromigration, time dependent dielectric breakdown (TDDB), hot carriers, negative bias temperature instability, radiation)
Utilizing a structured and controlled design process
A statistically controlled wafer fabrication process with a continuous defect reduction process
Individual wafer lot acceptance through process monitor testing
The use of characterized and qualified packages and assembly methods all parts are burned in at 250°C
Data collection of reliability at the component level has indicated the ability to operate within specification for 5 years or more at 225° C.
The adaptation of these SOI components with high temperature design techniques can provide dramatic improvements in the reliability and lifetime of intelligent completions. Over 2.5 million device hours of life testing have been completed at temperatures ranging from 250° C to 300° C.

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Honeywell Aerospace Silicon on Insulator CMOS Technology

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FAQs

Frequently Asked Questions

What is the typical lead time for gas turbine overhaul services?

The lead time for gas turbine overhaul services ranges from 6 to 14 weeks, depending on the damage assessment, parts availability, and whether hot-section repairs are required. Expedited options may reduce this by 30%.
Do you provide customizations for legacy turbine control systems?

Yes, we retrofit legacy systems (e.g., GE Frame 5, Siemens V94.2) with modern digital controllers, typically completing hardware integration within 4-8 weeks. Software migration requires additional validation time.
How often should industrial gas turbines undergo performance testing?

We recommend annual performance testing under ISO 3977-2 standards. Critical applications (e.g., offshore platforms) may require semi-annual tests with emissions compliance checks.
Are your radiation-hardened (rad-hard) semiconductors compliant with MIL-PRF-38535?

All rad-hard devices (e.g., FPGA, ADC) are QML Class V certified under MIL-PRF-38535 and tested to MIL-STD-883 Method 1019 for SEU tolerance. Full qualification reports are available upon request.
What temperature ranges do your military-grade ICs support?

Our ASICs and power management ICs operate across -55°C to +175°C ambient temperatures, with derating curves provided in military temperature range (MTR) datasheets.
Are PMA parts interchangeable with OEM components?

Our PMA parts (e.g., actuators, sensors) hold FAA/EASA Form 1 certification and match OEM form/fit/function. Installation requires SB/MB documentation per FAA AC 23.1529.
What traceability standards do you follow for aircraft fasteners?

All NAS/MS fasteners include full DNA traceability: melt source (AMS 2301), heat/lot numbers, and AS9100-compliant MTRs with ultrasonic test reports.
How do you handle urgent AOG (Aircraft on Ground) requests?

AOG orders ship within 4 hours for stocked items (FAA-PMA, EASA Part 21G). Non-stock critical parts trigger priority manufacturing with 72-hour max turnaround.